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Thipa Bakeng sa Mochini oa ho Roka
Boitsebiso: HSS Processing Technic: Wire Cut, polishing, Sila Ho Nepaha: 0.005 -
Industriel Sewing Machine Looper
Boitsebiso: HSS Processing Technic: Wire Cut, polishing, Sila Ho Nepaha: 0.005 -
Mohatelli oa Leoto
Boitsebiso: HSS Processing Technic: Wire Cut, polishing, Sila Ho Nepaha: 0.005 -
Looper Bakeng sa Mochini oa ho Roka
Boitsebiso: HSS Processing Technic: Wire Cut, polishing, Sila Ho Nepaha: 0.005 -
Tlatsa-Tool Square
Boitsebiso: HSS Processing Technic: Wire Cut, Polising, Griding Accuracy: 0.01-0.002 Mosebetsi oa Bophelo: Lilemo tse 10 MOQ: 1pc Haeba u hloka boitsebiso bo eketsehileng, ka kōpo ikutloe u lokolohile ho ikopanya le rona. -
Lehare bakeng sa mochini oa borashe
Boitsebiso: HSS Processing Technic: Wire Cut, Polishing, Griding Accuracy: 0.01-0.002 Mosebetsi oa Bophelo: Lilemo tse 10 MOQ: 1pc Haeba u hloka boitsebiso bo eketsehileng, ka kōpo ikutloe u lokolohile ho ikopanya le rona. -
Backstop Bakeng sa Brush Machine
Boitsebiso: HSS Processing Technic: Wire Cut, Polishing, Griding Accuracy: 0.01-0.002 Mosebetsi oa Bophelo: Lilemo tse 10 MOQ: 1pc Haeba u hloka boitsebiso bo eketsehileng, ka kōpo ikutloe u lokolohile ho ikopanya le rona. -
Arc Bakeng sa Mochini oa borashe
Boitsebiso: HSS Processing Technic: Wire Cut, polishing, Griding Accuracy: 0.01-0.002 Mosebetsi oa Bophelo: Lilemo tse 10 MOQ: 1pc Pls ikopanye le rona haeba u hloka boitsebiso bo eketsehileng. -
Upperplate Bakeng sa Mochini oa borashe
Boitsebiso: HSS Processing Technic: Wire Cut, Polising, Griding Accuracy: 0.01-0.002 Mosebetsi oa Bophelo: Lilemo tse 10 MOQ: 1pc Haeba u hloka boitsebiso bo eketsehileng, ka kōpo ikutloe u lokolohile ho ikopanya le rona. -
